High-Throughput pulse laser manufacturing etch process for complex and released structures from bulk 4H-SiC

Published in IEEE MEMS Conference, 2017

Recommended citation: Ransom, E.H, Dowling, K.M., Rocca-Bejar, D., Palko, J., Senesky, D, “High-Throughput pulse laser manufacturing etch process for complex and released structures from bulk 4H-SiC,” presented at IEEE MEMS Conference at Las Vegas, NV USA January 22-26 2017. https://doi.org/10.1109/MEMSYS.2017.7863497