Rapid Prototyping Tape Stencils for the Application of Solder Paste

Published in International Symposium on Microelectronics Packaging, 2017

Recommended citation: Yang, M.X., Dowling, K., Senesky, D., and Wong, H.-S.P., “Rapid Prototyping Tape Stencils for the Application of Solder Paste,” presented at the International Symposium on Microelectronics: Fall 2017, Vol. 2017, 1, pp. 000652-00065.