Inductive Coupled Plasma Etching of High Aspect Ratio Silicon Carbide Microchannels for Localized Cooling

Published in InterpackICNMM2015 , 2015

Recommended citation: Dowling, K., Suria, A., Shankar, A., Lee, H., Won, Y., Asheghi, M., Goodson, K., Senesky, D., “Inductive Coupled Plasma Etching of High Aspect Ratio Silicon Carbide Microchannels for Localized Cooling,” presented at InterpackICNMM2015 at San Francisco, CA July 5-9, 2015. DOI: 10.1115/IPACK2015-48409. https://doi.org/10.1115/IPACK2015-48409